您的位置: 首页 > 农业专利 > 详情页

Mold Inhibiting Package and Associated Methods for Fabricating and Packaging
专利权人:
发明人:
Charles W. Rutledge
申请号:
US15869458
公开号:
US20180222163A1
申请日:
2018.01.12
申请国别(地区):
US
年份:
2018
代理人:
摘要:
An example mold inhibiting package and associated methods are described. The mold inhibiting package includes walls formed from an outer layer affixed to an inner layer with the inner layer being in contact with the product. At least one of the outer layer or the inner layer is infused with a mold inhibitor during formation of the respective outer layer or inner layer. The mold inhibitor activates at a predetermined temperature or humidity level to prevent mold formation within an inner chamber of the package.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

意 见 箱

匿名:登录

个人用户登录

找回密码

第三方账号登录

忘记密码

个人用户注册

必须为有效邮箱
6~16位数字与字母组合
6~16位数字与字母组合
请输入正确的手机号码

信息补充