The present invention provides a substrate for ligand support in which a copolymer represented by the following formula (1) is bonded to at least a surface of a water-insoluble carrier: [in the formula (1), n and m represent a positive integer, and a value of m / (n + m) is greater than or equal to 0.1 and less than or equal to 0.45, R 1 represents H or CH 3 , R 2 represents an organic group including an electrophilic functional group, and R 3 represents本發明係提供一種配體固定化用基材,其係於非水溶性載體之至少表面鍵結下述通式(1)所示之共聚物而成。[化1][通式(1)中,n及m表示正整數,m/(n+m)之值為0.1以上、0.45以下;又,式(1)中,R1表示H或CH3,R2表示具有親電子官能基之有機基,R3表示如下之基:[化2]1...非水溶性載體2...共聚物10...鍵結部分20...R3基30...R2基(親電子官能基)100...配體固定化用基材
