導電性基板用金属粒子分散体及びその製造方法、並びに導電性基板の製造方法

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专利权人:

大日本印刷株式会社

发明人:

大森 吉信,喜 直信,小倉 教弘,村田 智基,北條 美貴子

申请号：

JP20140542093

公开号：

JP6119763(B2)

申请日:

2013.10.10

申请国别(地区):

日本

年份:

2017

代理人:

摘要：

The present invention is to provide a metal particle dispersion for electroconductive substrates, which has high dispersibility and dispersion stability and which is able to form a film that shows high electroconductivity after baking. Disclosed is a metal particle dispersion for electroconductive substrates, comprising metal particles, a dispersant and a solvent, wherein the dispersant is a graft copolymer having at least a constitutional unit represented by the following chemical formula (I) and a constitutional unit represented by the following chemical formula (II): (Symbols in the formulae are as described in the Description.)

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/