Krsmanovic, Jody L.,Colvin, Arthur E.,Colvin, Jason D.,Dehennis, Andrew
申请号：
AU2008226977
公开号：
AU2008226977B2
申请日:
2008.03.06
申请国别(地区):
AU
年份:
2013
代理人:
摘要：
A light emitting diode for harsh environments includes a substantially transparent substrate,a semiconductor layer deposited on a bottom surface of the substrate, severalbonding pads, coupled to the semiconductor layer, formed on the bottom surfaceof the substrate, and a micro post, formed on each bonding pad, for electrically connectingthe light emitting diode to a printed circuit board. An underfill layer may beprovided between the bottom surface of the substrate and the top surface of theprinted circuit board, to reduce water infiltration under the light emitting diodesubstrate. Additionally, a diffuser may be mounted to a top surface of the lightemitting diode substrate to diffuse the light emitted through the top surface.
