The image pickup module 40 includes a solid-state image pickup element 44 having a light receiving surface, a solid-state image pickup element 44 which is positioned inside the image pickup element projection region which is a projection region obtained by projecting the solid-state image pickup element 44 in the optical axis direction, A laminated substrate 46 having a connecting portion 461 on the front end side and a rear end side extending in the optical axis direction and on which the electronic components 55 to 57 are mounted and a solid state imaging device 44 and a laminated substrate 46 on the inner peripheral surface And a sleeve-like metallic reinforcing member 52 having both ends opened so as to cover the connecting portion 461 of the solid-state imaging device 44 and the mounting substrate 46 along the optical axis direction in a state in which the solid-state imaging device 44 and the mounting substrate 46 are separated from each other. The laminated substrate 46 has a connecting portion 461 Projecting portions 462 u and 462 d projecting to the outside of the image pickup device projection area in a state of being separated from the rear end of the reinforcing member 52 by a predetermined distance or more on the rear end side.撮像モジュール40は、受光面を有した固体撮像素子44と、固体撮像素子44を光軸方向に投影した投影領域である撮像素子投影領域の内側に位置し固体撮像素子44の裏面と接続固定される接続部461を先端側に有し、後端側が光軸方向に延出し配設され、電子部品55~57を実装した積層基板46と、内周面が固体撮像素子44および積層基板46と離間した状態で、固体撮像素子44および実装基板46の接続部461を光軸方向に沿って覆う両端が開口したスリーブ状の金属製の補強部材52とを備え、積層基板46は、接続部461より後端側において、補強部材52の後端から所定の距離以上離間した状態で、撮像素子投影領域の外側に突出する突出部462u,462dを有する。
