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MODULAR IMPLANT SYSTEM
专利权人:
DEPUY PRODUCTS; INC.
发明人:
GOODFRIED, GARY,LESTER, MARK,HAZEBROUCK, STEPHEN A.,BROWN, SCOTT C.
申请号:
AT04257122
公开号:
AT537780T
申请日:
2004.11.17
申请国别(地区):
AT
年份:
2012
代理人:
摘要:
A modular orthopaedic implant system comprises a first component (10A) having an articulating surface (20A) and an interior surface defining a tapered bore (26) and an exterior surface spaced from the articulating surface. At least a portion of the exterior surface surrounds the tapered bore, and is asymmetrical in at least one cross-section. The system includes a tapered metaphyseal component (12A) mountable to the distal femoral component.
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中国工程科技知识中心
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http://www.ckcest.cn/home/

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