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PATCH PREPARATION
专利权人:
Teikoku Seiyaku Co.; Ltd.
发明人:
KAWAKAMI, Satoshi
申请号:
EP15758321
公开号:
EP3115044A4
申请日:
2015.02.24
申请国别(地区):
EP
年份:
2017
代理人:
摘要:
Provided is a patch preparation that has improved adhesion to an adherend so as to enable a drug, especially, a systemically active drug to be stably and continuously administered over an extended period. The patch preparation has a layered structure comprising a patch layer including an adhesive plaster containing a drug and a patch support, and a cover layer in this order from a side attached to a skin. In the patch preparation, a buffer material is disposed between the patch support of the patch layer and the cover layer, the cover layer has a size covering an area beyond peripheral edges of the patch layer, and a shielding film is further disposed between the cover layer and the buffer material.
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中国工程科技知识中心
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