An improved process for manufacturing of embossed hard capsules from water-soluble polymers comprising the steps of (a) Dispersing the polymer in hot de-Ionized water at temperature above 60°C to make complete solution or suspension (b) applying minimum amount of mould releasing agent to the dipping moulds(c) dipping the capsule forming mould in the solution of temperature between 35°C to 80°C more preferably the dipping solution temperature should be 45 to 55 deg C (c) removing the mould along with wet mass around it at a pre determined velocity so as to get uniform film distribution (g) allowing the wet mass to cool for viscosity to rise due to solublisation / gellation (h) allowing the mass to dry, stripping the shell from mould and cutting it to specified length (i) pre-making the metal pins of appropriate artwork in reverse direction(j) heating the pins to appropriate temperatures(k) pressing the said preheated embossed pins on the preformed shells to form the emboss by effect of thermoforming (g) Allowing the wet mass to cool for viscosity to rise due to solublisation / gellation (h) Allowing the mass to dry, stripping the shell from mould and cutting it to specified length{i) Pre-make the metal pins of appropriate artwork in reverse direction(j) heat the pins to appropriate temperatures(k) The preheated embossed pins are then pressed on the preformed shells to form the emboss by effect of thermoforming.
