Device with strain relief structure for stretchable interconnect lines

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专利权人:

エムシー10 インコーポレイテッド;エムシー１０;インコーポレイテッド

发明人:

スー、ユン－ユー,スー、ユン-ユー

申请号：

JP2015559040

公开号：

JP6396928B2

申请日:

2014.02.24

申请国别(地区):

JP

年份:

2018

代理人:

摘要：

Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/