ULTRASONIC TRANSDUCER ELEMENT PACKAGE, ULTRASONIC TRANSDUCER ELEMENT CHIP, PROBE, PROBE HEAD, ELECTRONIC DEVICE, ULTRASONIC DIAGNOSTIC APPARATUS, AND METHOD FOR PRODUCING ULTRASONIC TRANSDUCER ELEMENT PACKAGE
An ultrasonic transducer element package includes a first substrate, a second substrate, a support body, and first and second ultrasonic transducers. The first substrate has first and second openings that are aligned in a first direction. The second substrate has a third and fourth openings that are aligned in the first direction. The support body supports the first and second substrates. The first and second substrates are aligned in a second direction that intersects with the first direction, with a space therebetween. The first and Second ultrasonic transducer elements are configured at the first and second openings respectively.
