A mold elimination apparatus for the purpose of removing molds and mildews is provided. The apparatus comprises an adhesive layer, a permeable film, and one or more absorbent pads carried on and joined by an impermeable or semi-permeable film. The absorbent pad or pads may be provided with a chemical composition suitable for the destruction and removal of molds and mildews, such as bleach. An associated method for the removal of molds and mildews is also provided.
