A composition for nail polish removal is disclosed. The composition for nail polish removal is applied to a nail to form a layer for nail polish removal, and then a UV gel is applied to the layer for nail polish removal or an acrylic resin is applied to the layer for nail polish removal to extend the nail. Therefore, the UV gel or the acrylic resin can be peeled off in a simple manner without the use of a special tool or the need to perform a special operation. In addition, the risk of damage to the nail can be greatly reduced. Also disclosed is a kit for nail polish removal including the composition.
