A connection pin for electrical connection of a cable mount. The connection pin has a thickened end for an integrally bonded connection to a conductor surface of the cable mount. At least part of the surface of the thickened end has a solderable coating with at least two functionally differentiated sub-layers arranged one above the other. One of the sub-layers is a solder connection layer with an anti-oxidation layer provided above the solder connection layer and/or an adhesion promoter layer provided beneath the solder connection layer.
