Disclosed is an ultrasonic probe wherein the warpage of a CMUT due to thermal stress produced at the joint between a backing layer and the CMUT is minimized, thereby improving the durability of the bond between the CMUT and the backing layer. To accomplish this the ultrasonic probe is provided with: a CMUT (20) having vibratory elements that change the electromechanical coupling coefficient or sensitivity according to the bias voltage to be applied a backing layer (22) adhered to the rear side of the ultrasonic transmission surface of the CMUT (20) and a thermal-stress balancing member (24) to be adhered to the backing layer (22) while being disposed facing the CMUT (20) in such a manner that the backing layer (22) is sandwiched therebetween so as to minimize the warpage of the CMUT (20) due to thermal stress produced between the CMUT (20).
