Kurt J. Koester,Chuladatta Thenuwara,Timothy Beerling,Mark B. Downing,David Stuursma,Logan P. Palmer
申请号:
US14873987
公开号:
US20160106988A1
申请日:
2015.10.02
申请国别(地区):
US
年份:
2016
代理人:
摘要:
A device includes a hermetically sealed case with electronic circuitry housed within. One surface of the hermetically sealed case includes a metallic plate and a co-fired ceramic electrical feedthrough with a number of vias. The co-fired ceramic electrical feedthrough is hermetically joined to the metallic plate and a hybrid circuit is connected to the feedthrough.