Kurt J. Koester,Chuladatta Thenuwara,Timothy Beerling,Mark B. Downing,David Stuursma,Logan P. Palmer
申请号：
US15477621
公开号：
US20170203108A1
申请日:
2017.04.03
申请国别(地区):
US
年份:
2017
代理人:
摘要：
A device includes a hermetically sealed case with electronic circuitry housed within. One surface of the hermetically sealed case includes a metallic plate and a co-fired ceramic electrical feedthrough with a number of vias. The co-fired ceramic electrical feedthrough is hermetically joined to the metallic plate and a hybrid circuit is connected to the feedthrough.
