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EXPANDED POLYSTYRENE PARTICLES HAVING SKIN LAYER WITH SUPERIOR MOLDABILITY, METHOD FOR PREPARING THE SAME AND EXPANDED POLYSTYRENE MOLDED ARTICLE USING THE SAME
专利权人:
Dong-Hyun Kim;Bong-Kuk Park
发明人:
Bong-Kuk Park,Dong-Hyun Kim
申请号:
US13266878
公开号:
US20120052127A1
申请日:
2010.04.16
申请国别(地区):
US
年份:
2012
代理人:
摘要:
Disclosed are an expanded polystyrene particle having a skin layer with superior moldability, a method for preparing the same, and an expanded polystyrene molded article using the same. Provided is an expanded polystyrene particle provided on the surface thereof with a skin layer with superior moldability wherein the skin layer contains a binder selected from the group consisting of a thermoplastic resin-based adhesive, a thermosetting resin-based adhesive, an inorganic adhesive, a protein-based adhesive and a mixture thereof, wherein the skin layer further contains methylene diphenyl diisocyanate.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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