您的位置: 首页 > 农业专利 > 详情页

Laser knife
专利权人:
ソニー株式会社
发明人:
保田 宏一,川久保 伸
申请号:
JP2008255023
公开号:
JP5493325B2
申请日:
2008.09.30
申请国别(地区):
JP
年份:
2014
代理人:
摘要:
<;P>;PROBLEM TO BE SOLVED: To provide a removal method using a laser knife and a laser both of which can be more miniaturized than before because there is the problem that both of the laser knife and the laser are generally large in size and made large-sized as the whole of an apparatus because short pulse output is achieved in a short pulse laser beam source by the action of an optical component provided on the outside of a light generator. <;P>;SOLUTION: Pulse like drive voltage exceeding a voltage value causing relaxation vibration or above is applied to a semiconductor laser to output a laser beam having a pulse-like specific peak from the semiconductor laser. Then, the laser beam having the pulse-like specific peak is condensed to a removal target. <;P>;COPYRIGHT: (C)2010,JPO&INPIT
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

意 见 箱

匿名:登录

个人用户登录

找回密码

第三方账号登录

忘记密码

个人用户注册

必须为有效邮箱
6~16位数字与字母组合
6~16位数字与字母组合
请输入正确的手机号码

信息补充