High-load microneedles and compositions for skin augmentation

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专利权人:

Avraham Amir

发明人:

AMIR, Avraham

申请号：

AU2019205874

公开号：

AU2019205874A1

申请日:

2019.01.06

申请国别(地区):

AU

年份:

2020

代理人:

摘要：

The present invention provides microneedles for administration of biocompatible materials effective in augmentation of skin or other skin treatments, and applicators comprising such microneedles. In particular, the microneedles and applicators of the present invention are aimed at filling the undesired lines, wrinkles, depressed scars and folds of a subject's facial and neck skin and restoring youthful fullness to the skin.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/