Jerry Ok;Neil Hamilton Talbot;Kelly H. McClure;Robert J. Greenberg;James Singleton Little;Jordan Matthew Neysmith;Rongqing Dai
发明人:
Jerry Ok,Robert J. Greenberg,Neil Hamilton Talbot,James Singleton Little,Rongqing Dai,Jordan Matthew Neysmith,Kelly H. McClure
申请号：
US13224104
公开号：
US08406887B2
申请日:
2011.09.01
申请国别(地区):
US
年份:
2013
代理人:
摘要：
The present invention is an improved hermetic package for implantation in the human body. The implantable device includes an electrically non-conductive substrate with electrically conductive vias. A flip-chip circuit is attached to the substrate using conductive bumps and electrically connected to a first subset of the vias. The flip-chip circuit can contain one or more stacks or a folded stack. A wire-bonded circuit is also attached to the substrate and electrically connected to a second subset of the vias. A cover is bonded to the substrate. The cover, substrate, and vias form an improved hermetic package for implantation.
