Electroless gold plating composition

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专利权人:

Rohm and Haas Electronic Materials LLC

发明人:

Kanzler, Miriana,Toben, Michael P.

申请号：

EP20020257270

公开号：

EP1306466(B1)

申请日:

2002.10.18

申请国别(地区):

欧洲专利局

年份:

2018

代理人:

摘要：

Disclosed are compositions suitable for electroless gold plating including one or more water soluble gold compounds, one or more gold complexing agents, one or more organic stabilizer compounds, and one or more carboxylic acid uniformity enhancers. Methods of plating and methods of manufacturing electronic devices using these compositions are also provided.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/