PROBLEM TO BE SOLVED: To provide an easy-to-manufacture imaging apparatus 1 where a light-receiving part 11 and an electrode pad 12 are disposed on a first main surface 10SA and the light-receiving part 11 is covered with a glass cover 30.SOLUTION: The imaging apparatus 1 comprises: a rectangular-parallelepiped imaging chip 10 made from semiconductor material and having plural function part patterns including the light-receiving part 11 formed on the first main surface 10SA； and the glass cover 30 made from transparent material, which has positioning marks 31 at respective two or more places in a predetermined positional relation with the function part patterns and is bonded via an adhesive layer so as to cover the light-receiving part 11.【課題】第１の主面１０ＳＡに受光部１１と電極パッド１２とが配設され、受光部１１がカバーガラス３０で覆われた、製造が容易な撮像装置１を提供する。【解決手段】撮像装置１は、受光部１１を含む複数の機能部パターンが第１の主面１０ＳＡに形成された、半導体材料からなる直方体の撮像チップ１０と、機能部パターンと所定の位置関係にある少なくとも２箇所に、それぞれ位置合わせマーク３１が形成されており、受光部１１を覆うように接着層を介して接着されている透明材料からなるカバーガラス３０と、を具備する。【選択図】図１
