CAL-COMP ELECTRONICS & COMMUNICATIONS COMPANY LIMITED; INC.;KINPO ELECTRONICS, INC.;KINPO ELECTRONICS
发明人:
HARAIKAWA, KOICHI,祓川浩一,CHIEN, JEN CHIEN,简仁建,簡仁建,HSU, TSAI CHIEH,徐采洁,徐采潔,LIU, CHIH WEI,刘至伟,劉至偉
申请号：
TW103140965
公开号：
TWI531471B
申请日:
2014.11.26
申请国别(地区):
TW
年份:
2016
代理人:
摘要：
A textile structure used for being electrically connected to an electronic device is provided. The textile structure includes a first fabric layer, a second fabric layer, and a third fabric layer. The second fabric layer is electrically conductive. The first, the second, and the third fabric layers are combined with each other, and the second fabric layer is located between the first and the third fabric layers. The third fabric layer has an opening covered by the second fabric layer, and a portion of the second fabric layer is exposed out of the third fabric layer through the opening. The electronic device is electrically connected to the second fabric layer, and a connection portion thereof is located far away from the opening.一種織物結構，適於電性連接電子裝置。織物結構包括第一織物層、第二織物層以及第三織物層。第二織物層具有導電性。第一織物層、第二織物層與第三織物層彼此結合，且第二織物層位於第一織物層與第三織物層之間。第三織物層具有開口，第二織物層涵蓋開口且第二織物層的局部從開口暴露出。電子裝置電性連接第二織物層，且電子裝置與第二織物層的連接處遠離於開口。
