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Electronic Stickers with Modular Structures
专利权人:
发明人:
Junfeng Mei,Jiang Li
申请号:
US15980564
公开号:
US20180256107A1
申请日:
2018.05.15
申请国别(地区):
US
年份:
2018
代理人:
摘要:
An electronic sticker assembly includes a first electronic sticker comprising an upper surface, a lower surface, and first one or more conductive connection dots on the upper surface, a first adhesive layer on the first electronic sticker and comprising a first window. The first window is positioned to expose the first one or more conductive connection dots. A second electronic sticker on the first adhesive layer includes a lower surface and one or more second conductive connection dots on the lower surface. The first conductive connection dots on the upper surface of the first electronic sticker are in contact with the one or more second conductive connection dots on the lower surface of the second electronic sticker through the first window in the first adhesive layer.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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