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ULTRASOUND TRANSDUCER MODULE AND ULTRASOUND ENDOSCOPE
专利权人:
OLYMPUS CORPORATION
发明人:
Kei IRIE
申请号:
US15856572
公开号:
US20180132820A1
申请日:
2017.12.28
申请国别(地区):
US
年份:
2018
代理人:
摘要:
An ultrasound transducer module includes: an ultrasound transducer configured to transmit and receive ultrasound; a substrate electrically connected with the ultrasound transducer and including a first wiring pad at a portion different from a connection portion with the ultrasound transducer; and a casing that includes an accommodation hole for accommodating the ultrasound transducer and the substrate and that includes a holding hole continued to the accommodation hole and capable of holding a portion of the substrate, the casing having a plurality of electrode pads provided on an outer surface of the casing and having a plurality of second wiring pads provided in the holding hole, each second wiring pad being electrically connected with a corresponding electrode pad among the plurality of electrode pads, and electrically connected with the first wiring pad.
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中国工程科技知识中心
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http://www.ckcest.cn/home/

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