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撮像モジュールおよび内視鏡
专利权人:
オリンパス株式会社
发明人:
堺 洋平
申请号:
JP2014103543
公开号:
JP6335636B2
申请日:
2014.05.19
申请国别(地区):
JP
年份:
2018
代理人:
摘要:
PROBLEM TO BE SOLVED: To provide an imaging module 1 which releases heat generated by an imaging device 20 efficiently.SOLUTION: An imaging module 1 includes an imaging device 20, a wiring board 40, and a cooling device 30. The cooling device 30 is arranged in between the imaging device 20 and the wiring board 40. A rear surface 20SB of the imaging device 20 and a first main surface 30SA of the cooling device 30 are coupled via a high-heat conductive material having heat conductivity of 1 W/(m K) or more. A second main surface 30SB of the cooling device 30 and a tip end surface 40SA of the wiring board 40 are arranged to face.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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