PROBLEM TO BE SOLVED: To provide a radiation imaging apparatus with reduced manufacturing costs.SOLUTION: A radiation imaging apparatus 1 comprises a sensor substrate 10 having: a plurality of photodiodes 111A as photoelectric conversion elements formed on a substrate 11 a thin-film transistor 111B as a driving element for the photodiodes 111A and a wavelength conversion layer 20 which converts wavelengths of incident radiation into those in a sensitive region of the photoelectric conversion elements. The wavelength conversion layer 20 is directly formed within the sensor substrate 10, so that there is no need to additionally attach a substrate having a wavelength conversion layer, reducing manufacturing processes and thereby lowering manufacturing costs.COPYRIGHT: (C)2013,JPO&INPIT【課題】製造コストを低減した放射線撮像装置を提供する。【解決手段】放射線撮像装置1は、基板11上に形成された複数の光電変換素子であるフォトダイオード111Aと、フォトダイオード111Aの駆動素子である薄膜トランジスタ111Bと、入射した放射線を光電変換素子の感度域に波長変換する波長変換層20とを有するセンサー基板10を備え、波長変換層20がセンサー基板10内に直接形成され、波長変換層を有する基板を別途貼り合わせる必要がなく、製造工程を削減することで製造コストを低減する。【選択図】図1
