Catalyst solution for electroless plating and method for electroless plating

• 收藏
• 分享

专利权人:

Rohm and Haas Electronic Materials LLC

发明人:

Okada, Hiroki,Shenghua, Li,Hayashi, Shinjiro

申请号：

EP20140190993

公开号：

EP2868771(B1)

申请日:

2014.10.30

申请国别(地区):

欧洲专利局

年份:

2018

代理人:

摘要：

The present invention relates to a stable palladium ion catalyst aqueous solution for electroless metal plating that does not use boric acid and can be used stably over a wide pH range. The catalyst solution for electroless plating of the present invention contains palladium ion, palladium ion complexing agent, and a specific amine compound and is alkaline.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/