A heat dissipating assembly of a mold includes an angular pin, a heat pipe, and a liquid passage passing through the angular pin. The angular pin defines a receiving chamber therein. The liquid passage passes through a lower portion of the receiving chamber of the angular pin. The heat pipe includes a condensing section, an evaporation section, and a connecting section interconnecting the condensing section and the evaporation section. The evaporation section is embedded in an upper portion of the receiving chamber opposite to the lower portion. The condensing section is located in the lower portion of the receiving chamber. A mold having the heat dissipating assembly is also provided.
