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THERMOPLASTIC RESIN COMPOSITION AND MOLDED PRODUCTS FORMED THEREOF
专利权人:
发明人:
Yoshikatsu MIZUKAMI,Eiji IWASA
申请号:
US14268311
公开号:
US20140287009A1
申请日:
2014.05.02
申请国别(地区):
US
年份:
2014
代理人:
摘要:
One form of the present invention provides a resin composition and a molded product formed thereof, wherein a polymer composition which includes a thermoplastic base polymer or base polyblend (A), a thermoplastic base polymer or base polyblend (B) having no compatibility with the (A), and fluid (C) included as a nanoparticle suspension having compatibility with neither (A) nor (B) and containing nanoparticles uniformly dispersed at a temperature lower than or equal to the thermal decomposition temperature of (A) or (B), and in which interfaces between three layers made of (A), (B), and (C) form three-dimensional continuous parallel interfaces, and the nanoparticles of (C) having an average particle size from 1 μm to 1 nm after removal of a dispersion medium of (C) by evaporation are locally unevenly dispersed in the pattern of a curve or a straight line connecting consecutive points at a fracture surface, and are macroscopically uniformly dispersed.
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