The invention relates to a fingerprint sensing device comprising: a sensing chip comprising an array of sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of the sensing elements and a finger placed on a sensing surface of the sensing device wherein a surface of the sensing elements define a sensing plane； a plurality of interposer structures arranged on the sensing chip extending above sensing plane wherein the plurality of interposer structures have substantially the same height above the sensing plane； and a protective plate attached to the sensing chip by means of an adhesive arranged on the sensing chip wherein the protective plate rests on the interposer structures such that a distance between the protective plate and the sensing plane is defined by the height of the interposer structures.
