#$%^&*AU2016210633B220180906.pdf#####Abstract 5 In a device for material processing by means of laser radiation, said device comprising a source of laser radiation (S) emitting pulsed laser radiation (3) for interaction with the material (5)； optics (6) focusing the pulsed processing laser radiation (3) to a center of interaction (7) in the material (5)； a scanning unit (10) shifting the positions of the center of interaction within the material (5), wherein each processing laser pulse interacts with the material (5) in a zone (8) 10 surrounding the center of interaction (7) assigned to said laser pulse so that material (5) is separated in the zones of interaction (8)； and a control unit (17) which controls the scanning unit (10) and the source of laser radiation (S) such that a cut surface (9) is produced in the material (5) by sequential arrangement of zones of interaction (8), it is envisaged that the control unit (17) controls the source of laser radiation (S) and the scanning unit (10) such that adjacent 15 centers of interaction (7) are located at a spatial distance a s 10 pm from each other. (Fig. 6)131 / 1 678 90111115678922222 5.0 4.5400 1 2 3 4 5 '；78 I ' ~ 9v3 1 141511711920 2122 2324 4.54,0
