A stacked ultrasound vibration device 2 includes a stacked piezoelectric body unit 75 in which a plurality of piezoelectric bodies 61 and a plurality of electrode layers 62, 63 are stacked and integrated, a first bonding material 73 that bonds the plurality of piezoelectric bodies 61 and melts at a first bonding temperature lower than a half of a Curie temperature of the plurality of piezoelectric bodies 61, and a second bonding material 76 that bonds the stacked piezoelectric body unit 75 and the two mass materials 42, 43 and melts at a second bonding temperature lower than the first bonding temperature and higher than a maximum temperature during driving.
