A stacked ultrasound vibration device includes a stacked piezoelectric body unit in which a plurality of piezoelectric bodies and a plurality of electrode layers are stacked and integrated, a first bonding material that bonds the plurality of piezoelectric bodies and melts at a first bonding temperature lower than a half of a Curie temperature of the plurality of piezoelectric bodies, and a second bonding material that bonds the stacked piezoelectric body unit and the two mass materials and melts at a second bonding temperature lower than the first bonding temperature and higher than a maximum temperature during driving.
