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Location Control Apparatus for Bone Resection
专利权人:
A Plus Biotechnology Company Limited
发明人:
Kai-Hsing Wu,Hsiang-Wei Lo,Kun-Jhih Lin,Ping-Sheng Yu
申请号:
US16005764
公开号:
US20190282243A1
申请日:
2018.06.12
申请国别(地区):
US
年份:
2019
代理人:
摘要:
The present invention is a location control apparatus for bone resection, the location control apparatus includes a guiding module, located at the bottom of the location control apparatus for bone resection, a blocking plate module, formed on the rear end of the guiding module and has a protruding shape, and, a guide groove, located at the bottom of the blocking plate module to allow a osteotome or bone saw to be inserted, wherein the dimension of the inserted osteotome or bone saw could be adjusted.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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