A microneedle device having a coating including a high molecular weight pharmaceutical compound substantially uniformly is provided. A microneedle device (1) includes a plurality of microneedles (3) on a microneedle substrate (2), which are capable of piercing the skin. A portion of or entire surface of the microneedles (3) and/or the microneedle substrate (2) has a coating including a coating carrier in a solid state. The coating carrier includes a high molecular weight pharmaceutical compound and polysaccharides compatible with the high molecular weight pharmaceutical compound. Herein, as the polysaccharide, for example, pullulan or hydroxypropylcellulose can be used.
