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Microneedle device
专利权人:
久光製薬株式会社
发明人:
松戸 俊之,桑原 哲治,徳本 誠治
申请号:
JP2009538116
公开号:
JP5419702B2
申请日:
2008.10.15
申请国别(地区):
JP
年份:
2014
代理人:
摘要:
A microneedle device having a coating including a high molecular weight pharmaceutical compound substantially uniformly is provided. A microneedle device (1) includes a plurality of microneedles (3) on a microneedle substrate (2), which are capable of piercing the skin. A portion of or entire surface of the microneedles (3) and/or the microneedle substrate (2) has a coating including a coating carrier in a solid state. The coating carrier includes a high molecular weight pharmaceutical compound and polysaccharides compatible with the high molecular weight pharmaceutical compound. Herein, as the polysaccharide, for example, pullulan or hydroxypropylcellulose can be used.
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