您的位置: 首页 > 农业专利 > 详情页

超音波トランスデューサー素子チップおよびプローブ並びに電子機器および超音波診断装置
专利权人:
セイコーエプソン株式会社
发明人:
中村 友亮,鶴野 次郎,清瀬 摂内
申请号:
JP2017039098
公开号:
JP6311815B2
申请日:
2017.03.02
申请国别(地区):
JP
年份:
2018
代理人:
摘要:
PROBLEM TO BE SOLVED: To provide a thin ultrasonic transducer element chip having strength enduring pressing force in a thickness direction of a substrate.SOLUTION: In an ultrasonic transducer element chip, a substrate 21 is disposed with openings 45 in an array state. In a first face of the substrate 21, each opening 45 is provided with an ultrasonic transducer element 23. A reinforcing member 52 is fixed on a second face on the opposite side of the first face of the substrate 21. The reinforcing member 52 reinforces the substrate 21. Groove parts 53 form ventilation passages communicating an inner space of the opening parts 45 and an outer space of the substrate 21.SELECTED DRAWING: Figure 4
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

意 见 箱

匿名:登录

个人用户登录

找回密码

第三方账号登录

忘记密码

个人用户注册

必须为有效邮箱
6~16位数字与字母组合
6~16位数字与字母组合
请输入正确的手机号码

信息补充