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硬化用光照射装置及びスプライス部を含む電線モジュールの製造方法
专利权人:
住友電装株式会社
发明人:
松野 大志,居原 利幸,土持 慶次,米谷 敏夫
申请号:
JP20140030227
公开号:
JP6128006(B2)
申请日:
2014.02.20
申请国别(地区):
日本
年份:
2017
代理人:
摘要:
A light irradiating device used for curing and a manufacturing method of a wire module comprising a wiring part are provided. The light irradiating device aims to enable a light curing agent attached to the periphery of a processing object part of a wire to be cured more reliably. The light irradiating device used for curing comprises: a light irradiating part (110); a rotation support mechanism (120) for enabling the light irradiating part (110) to be rotatably supported around a processing object part of the wire (22), i.e., a wiring part, in the case of enabling a light from the light irradiating part (110) to irradiate towards the processing object part of the wire supported at a curing processing position P; and a rotation driving mechanism (130) for enabling the rotation support mechanism (120) to rotate. And preferredly, the plurality of light irradiating parts (110) are rotatably supported around the processing object part of the wire, and rotate at a rotating angle within the range less than 360 degr
来源网站:
中国工程科技知识中心
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