Erin Kristen Webb,Thomas Lee Williams,Dana Sachs,Danielle Frankson
申请号：
US15880221
公开号：
US20180207427A1
申请日:
2018.01.25
申请国别(地区):
US
年份:
2018
代理人:
摘要：
An electronics module for use in an Implantable Medical Device (IMD) may include a plurality of electrical components connected to form a circuit that includes a terminal and a potting material that supports the plurality of electrical components. The plurality of electrical components and the potting material together form a circuit sub-module in which the terminal is accessible from outside of the circuit sub-module. A metallic layer that conforms to an outer surface of the circuit sub-module is provided thereon such that the terminal is accessible from outside of the metallic layer.
