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HEAT DISPERSION FOR IMPLANTABLE MEDICAL DEVICES
专利权人:
Jay H. EIGER
发明人:
Jay H. EIGER
申请号:
US13359739
公开号:
US20130197608A1
申请日:
2012.01.27
申请国别(地区):
US
年份:
2013
代理人:
摘要:
An implantable medical device that includes electrical circuitry for providing a therapy to a patient. The device also includes a housing forming an inner chamber that is adapted for receiving, at least a portion of the electrical circuitry. The device further includes a thermally conductive material that is configured to disperse heat from a first portion of the implantable medical device that is located in proximity to a heat generating component of the electrical circuitry, to a second portion of the implantable medical device that is not located in proximity to said heat generating component. The thermally conductive material is a discrete component separate from the electrical circuitry and the housing.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
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