医療器具部品および医療器具
- 专利权人:
- オリンパス株式会社
- 发明人:
- 須田 信行,金子 浩之
- 申请号：
- JP2009095202
- 公开号：
- JP5378044B2
- 申请日:
- 2009.04.09
- 申请国别(地区):
- JP
- 年份:
- 2013
- 代理人:
- 摘要：
PROBLEM TO BE SOLVED: To eliminate the need of working for correcting the outline shape after bonding and to achieve excellent uniformity of bonding strength in a wiring fixing method for a medical instrument part, a medical instrument part and a medical instrument.
SOLUTION: An operating wire 13 is fixed to a tip curved piece 11 by the following steps of a fixing method. That is, the method includes: a wire disposing process of disposing the operating wire 13 closed to a wire installation part made of amorphous alloy having a glass transition region having a temperature width of 20°C or more a temperature rise process of elevating the temperature of the wire installation part to the glass transition region a pressing process of pressing and deforming the wire installation part in the state of keeping the temperature of the wire installation part elevated to the glass transition region in the glass transition region, and making the same closely adhere to the operating wire 13 and a bonding process of lowering the glass transition temperature to a lower temperature while keeping the wire installation part deformed by the pressing process to the pressed state to thereby form a wire bonding part 11c where the wire installation part is deformed on the outer peripheral part of the operating wire 13.
COPYRIGHT: (C)2011,JPO&INPIT
- 来源网站：
- 中国工程科技知识中心
