An electric module including a first member in which a plurality of first electrodes are arranged on a first face, a second member in which a plurality of second electrodes are arranged on a second face facing the first face, first resin for adhering the first face with the second face, and a bonding portion for electrically connecting each of the first electrodes and each of the second electrodes. The bonding portion is formed of an electroless plating membrane, and the first resin is arranged around the bonding portion.
