The present invention relates generally to devices and methods for firmly joining together components of a modular orthopedic prosthesis by securing female to male parts thereof together, and in particular a male part present in a modular component into a correspondingly configured female part (i.e., bore or recess) present in a further modular component thereof. Preferably the male part is tapered, and the bore or recess is correspondingly configured to provide a close tolerance fit therewith. In a preferred embodiment a securement device is used to join the components which securement device includes a heat resistant part or region which shields a heated part from its ambient environment； the securement device is useful in holding a component of an orthopedic prosthesis. In a further preferred embodiment the invention also comprises a heat treatment device which is issued to provide a suitable heat treatment to a component (or part thereof) of a modular orthopedic prosthesis. Methods of utilizing the securement device and the heat treatment device during surgical implantation of modular orthopedic prosthesis is also disclosed.
