An endoscope apparatus includes:a solid-state imaging element having a light receiving surface on a front face thereof a circuit board arranged on a rear face side of the solid-state imaging element, the circuit board having a wiring pattern a part of which is exposed on a distal end side of the circuit board, the distal end side facing the solid-state imaging element a first heat dissipation member arranged between the solid-state imaging element and the exposed part of the wiring pattern and a cable electrically connected to the wiring pattern.
