In order to provide a kind of imaging sensor can realize between compatibility miniaturise and high image quality. The imaging sensor includes: multiple transmit capacities 252, and each capacity 252 is provided at each vertical transfer ducts 239 and has groove structure Multiple column reading circuits, each column reading circuit include column source follower transistor 244, clamp switch 253, and each column reading circuit is provided at each vertical transfer ducts 239 and passes through second gas diffusion layer 31 with transfer capacity 252 Multiple column scan circuits, each column scan circuit includes that column select switch 254 is connected to vertical transfer pipeline 239 and is configured as output to picture signal from vertical transfer ducts 239 by column source follower transistor 244 via transfer capacity 252, and each column scan circuit is provided at a corresponding column reading circuit Horizontal pipeline 258 is configured as transmission signal With constant-current source 257.
