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Seams joining two or more web materials
专利权人:
エスセーアー・ハイジーン・プロダクツ・アーベー
发明人:
ハンス・エーン,マルクス・レト,ウルリカ・カールソン
申请号:
JP2010539347
公开号:
JP5155411B2
申请日:
2007.12.20
申请国别(地区):
JP
年份:
2013
代理人:
摘要:
A seam joining together at least two web materials in an overlapped manner by ultrasonic welding, heat bonding or the like, in a bonding pattern, which includes comprising a first bonding pattern and at least one second bonding pattern extending in a longitudinal direction along and adjacent at least one side edge of the overlapped portion. The bonded area of the second bonding pattern occupies more than 30% of the combined bonded area of the first and second bonding patterns. The bonding elements of the first bonding pattern have a mean area that is at least 2 times the mean area of the bonding elements of the second bonding pattern. The contact area of the bonding pattern, as seen in transverse direction of the seam, is between 10 and 30% of the width of the bonding pattern at any given point along the length of the bonding pattern.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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