PROBLEM TO BE SOLVED: To provide a wafer cleaning machine capable of efficiently cleaning a wafer with a small amount of a cleaning liquid and utilizing surface tension, and a method for cleaning a wafer using the wafer cleaning machine.SOLUTION: A spin cleaning machine of the present invention includes: a stage 34 on which a wafer W is placed; a rotation drive section 34b for rotating the stage 34 in a circumferential direction; a liquid discharge nozzle 35 provided to face the wafer W placed on the stage 34 and supplying a cleaning liquid L on the wafer W placed on the stage 34; and a control unit 4 for allowing the cleaning liquid L of a predetermined amount for filling a space S to be supplied into the space S through the liquid discharge nozzle 35, the space S being formed between the wafer W placed on the stage 34 and the liquid discharge nozzle 35.
