Thermal desorption system for implantable devices

• 收藏
• 分享

专利权人:

マイクロベンション インコーポレイテッド

发明人:

マシュー フィッツ,ジョセフ グラシェンスキー

申请号：

JP2011156145

公开号：

JP5400837B2

申请日:

2011.07.14

申请国别(地区):

JP

年份:

2014

代理人:

摘要：

The present disclosure provides for implant delivery systems and related methods. The delivery systems of the present disclosure incorporate in an aspect a thermally activated attachment member, such as a tether that can be pre-stretched, and an activateable heater for releasing said implant. A method of releasing an implant as well as a method of detecting detachment of an implant are as well disclosed.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/