PROBLEM TO BE SOLVED: To provide an imaging device including a configuration allowing avoidance of contact of a mounted member on a substrate with an exterior member when the device is assembled while miniaturizing the device, and securely preventing displacement of a portion of the substrate where the mounted member is provided.SOLUTION: A substrate fixing member 20 includes: a fixing part 20a where a first portion 22a is fixed a substrate downward pressing part 20b for positioning a mounting surface 22bj of a mounting area A lower than an upper surface 22at by pressing down a second portion 22b lower than the upper surface 22at of the first portion 22a and cranking the second portion 22b, and fixing the position of the second portion 22b and a housing part 20c having a wall 52 surrounding the mounting area A as seen from the top for housing an electronic component 151 mounted on the mounting surface 22bj of the mounting area A. An apex 52t of the wall 52 is located at a height position higher than the electronic component 151 but not higher than the upper surface 22at of the first portion 22a.COPYRIGHT: (C)2013,JPO&INPIT【課題】小型化を図りつつ、組み立ての際、外装部材への基板上の搭載部材の接触を回避でき、さらに基板の搭載部材が設けられた部位の位置ずれを確実に防止できる構成を具備する撮像装置を提供する。【解決手段】基板固定部材20は、第1の部位22aが固定される固定部20aと、第2の部位22bを第1の部位22aの上面22atよりも低く押し下げてクランク状に折り曲げることにより、実装エリアAの実装面22bjを上面22atよりも低く位置させるとともに第2の部位22bの位置を固定する基板押し下げ部20bと、実装エリアAの実装面22bjに実装された電子部品151を収納するとともに、平面視した状態において実装エリアAを囲む壁部52が設けられた収納部20cと、を有し、壁部52の頂部52tは、電子部品151よりも高く、第1の部位22aの上面22at以下の高さに位置している。【選択図】図3
